This module introduces advanced concepts of Building Information Modeling (BIM) to provide students with advanced knowledge in order to understand, analyze and discuss scientific research approaches related to BIM. Within the frame of the module project (coursework) the students will choose a topic from a pre-defined list or come up with their own topic. Based on that they will do detailed research, implement a representative concept in a software prototype and discuss findings and limitations. Also the students acquire skills of scientific working and presentation.
Content:
- Advanced geometric and parametric modelling,
- Interoperability and collaboration concepts (IFC, IDM, BEP),
- Advanced use cases (e.g. clash detection, as-built modeling),
- BIM programming (incl. visual programming)
Requirements for participation
| Recommended | Basic knowledge of Computer-Aided Design, BIM concepts, and object-oriented programming. |
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Workload and required examination
| In-class study / online-study: | 45 |
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| Self-study: | 105 |
| Exam preparation: | 30 |
| Type of examination: | Written exam, written report, presentation |
| Requirements for exam registration: | 1 early presentation on selected research topic outlining the plan of work |
| Duration/Scope: | 20-40 pages report |
| Weighting: | |
| Courses with SWS / ECTS: | This module is comprised of: “Advanced Building Information Modelling” (Lecture, 2 SWS) “Advanced Building Information Modelling” (Seminar, 2 SWS) |
Literature
- Eastman, C., Teichholz, P., Sacks, R., Liston, K. (2011), BIM Handbook: A guide to Building Information Modelling, 2nd edition, Wiley.
- Borrmann, A., König, M., Koch, C., Beetz, J. (2018), Building Information Modeling: Technological Foundations and Industry Practice, Springer Vieweg.
- Mortenson, M.E. (2006), Geometric Modeling, 3rd edition, Instustrial Press.
- Shah, J.J., Mäntylä, M. (1995), Parametric and feature - based CAD/CAM - Concepts, Techniques and Applications.
- Liebich, T. (2009), IFC 2x Edition 3 Model Implementation Guide, Version 2.0.